HEAT-RESISTANT ADHESIVE COMPOSITION AND METHOD FOR ADHERING THEREWITH

• Main Authors: NOMURA HIROSHI, NAGAO KOICHI, SATO EIKICHI, SAKAIRI KOSHI, SUZUKI MASAKATSU, IMAIZUMI JUNICHI
• Format: Patent
• Language: English
• Published: 06.09.1991
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; DYES; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; PAINTS; POLISHES; PRINTED CIRCUITS; USE OF MATERIALS AS ADHESIVES

PURPOSE:To easily obtain an adhesive compsn. having an excellent resistance to heat and chemicals, flame retardance, flexibility, etc., and enabling adhesion at a relatively low temp. by mixing a specific polyamic acid soln. with a specified amt. of a bismaleimide compd. CONSTITUTION:A polyamic acid soln. after the completion of the imdizing reaction and contg. 100 pts.wt. polyamic acid with a glass transition point of 260 deg.C or lower {e.g. a compd. of formula I[wherein n>=1; R1 is a group of formula II, III, or IV (wherein R3 to R6 are each H, halogen, or 1-4C alkyl; and X and Y are each a divalent element or group such as O, SO2, CO, or S); and R2 is a group of formula V, VI, VII, or VIII]} [e.g. a compd, of formula IX (wherein n>=1; R1 and R2 are each 1-4C alkyl or CH3; and R3 to R6 are each H, halogen, or 1-4C alkyl)] is mixed with 20-60 pts.wt. bismaleimide compd. [e.g. N,N'-(methylenedi-p-phenylene)bismaleimide]. Thus is easily prepd. an adhesive compsn. having an excellent resistance to heat and chemicals, flame retardance, flexibility, etc., and enabling an adherend to be adhered at a relatively low temp. 250 deg.C or lower.