SOLID IMAGE-PICKUP ELEMENT

PURPOSE:To cope with high density and high-speed drive by connecting parallel alumina wirings to a first-layer polysilicon electrode layer, turning a second- layer polysilicon electrode layer into silicide, and then adjusting each resistance for setting time constant of each electrode layer to be ne...

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Bibliographic Details
Main Author YAMAWAKI MASAO
Format Patent
LanguageEnglish
Published 12.08.1991
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Summary:PURPOSE:To cope with high density and high-speed drive by connecting parallel alumina wirings to a first-layer polysilicon electrode layer, turning a second- layer polysilicon electrode layer into silicide, and then adjusting each resistance for setting time constant of each electrode layer to be nearly equal. CONSTITUTION:In a solid image-pickup element where a first-layer polysilicon electrode layer 12 and a second-layer polysilicon electrode layer 13 which is extended in parallel to the first-layer polysilicon electrode layer 12 are transfer electrodes, an alumina wiring 16 which is in parallel to the first-layer polysilicon electrode layer 12 is connected to it, the second-layer polysilicon electrode layer 13 is turned into silicide, and each resistance is adjusted, thus enabling time constant of each electrode layer 12 and 13 to be set to nearly the same value. Therefore, it becomes possible to reduce delay of a drive clock waveform within a CCD easily for coping with high density and high-speed drive in a solid image-pickup element favorably.
Bibliography:Application Number: JP19890324542