THICK FILM RESISTANCE ELEMENT

• Main Author: OKI KENICHI
• Format: Patent
• Language: English
• Published: 10.07.1991
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRICITY; RESISTORS

PURPOSE:To reduce the lowering (changing) rate of resistance value after burning is performed and render a thick film resistance element more compact and then, prevent microcracks in the above element from developing by defining the length of a resistor with an insulator in such a way that generally its thickness is enough to be one-half that of the resistor and making a pair of conductors connecting to the above resistor have structure where each pointed end of the conductor is put on top of the insulator. CONSTITUTION:At least both end parts in the length direction of a thick film resistor 12 are exposed to the outside on an insulating substrate 1 on which the thick film resistor 12 is formed and an insulator 13 is provided over the whole width of the above resistor 12. Then, the insulator 13 is deposited respectively on both ends of the above resistor 12 and a pair of conductors 14 and 15 are formed in such a way that one end part of each conductor is located on the insulator 13. Consequently, changes in effective length of the resistor 12 become low and as it is not feared that 'sag' in each end part of the conductors that are facing each other gives rise to a short circuit in the above conductors, the situation of the conductors shortens the intervals of conductors facing each other. (i.e., miniaturization) In this way, the thickness of each conductor at a part connecting to the resistor becomes thicker than those in conventional constructions and microcracks in the resistor become hard to develop.