BINDING DEVICE
PURPOSE:To make the carrying direction of objects to be bound to be one direction, and hold the leading tip of a thermal contact bondable tape assuredly, and bind the objects to be bound by a method wherein after forming a folded back part, a thermal contact bondable tape is pulled out along the lon...
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Main Authors | , |
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Format | Patent |
Language | English |
Published |
23.01.1991
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Subjects | |
Online Access | Get full text |
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Summary: | PURPOSE:To make the carrying direction of objects to be bound to be one direction, and hold the leading tip of a thermal contact bondable tape assuredly, and bind the objects to be bound by a method wherein after forming a folded back part, a thermal contact bondable tape is pulled out along the longitudinal direction of a carrying path and pushed in a gripping frame from the carrying path, and the folded back part is thermally welded. CONSTITUTION:After folding the leading tip of a thermal contact bondable tape B from a lower end edge 5b1, a heater for temporary attaching 4b approaches and thermally contact bonds the tape B along the longitudinal direction to form a folded back part B2. Both grips 5 close, and the tape B is made to pass through an insertion space 1c of a group of paper A and pulled out linearly under the carrying path 1, and wound around the group of paper A in an approximate U-shape. The folded back part B2 is fitted in a recessed notch part 6d of a gripping frame 6 which waits under a horizontal condition. A protruding basic end B3 of the thermal contact bondable tape B hits a tilted surface 7a of a folding guide 7 and is folded backward in a horizontal condition immediately before standing up in a rectangular condition accompanying with the upward rotation of the gripping frame 6. Then, a heater 8 inserts the basic end B3 in the turning track of the gripping frame 6, and leads it in the recessed notch part 6 under a tensile condition while bending it downward, and places it over the folded back part B2 and thermally contact bond them. |
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Bibliography: | Application Number: JP19890144606 |