MULTILAYERED RESIN FILM

PURPOSE:To obtain a multilayered resin film which can be formed into an optional shape and easily manufactured by a method wherein the resin film is provided with a continuous part which is easily deformable by heat. CONSTITUTION:A circuit wiring is formed on a resin film 11 of, for instance, polyca...

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Bibliographic Details
Main Author YOKOMIZO YUJI
Format Patent
LanguageEnglish
Published 17.05.1991
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
LAYERED PRODUCTS
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PERFORMING OPERATIONS
PRINTED CIRCUITS
TRANSPORTING
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Summary:PURPOSE:To obtain a multilayered resin film which can be formed into an optional shape and easily manufactured by a method wherein the resin film is provided with a continuous part which is easily deformable by heat. CONSTITUTION:A circuit wiring is formed on a resin film 11 of, for instance, polycarbonate, polyvinyl chloride, polystyrene, saturated polyester, or the like, and furthermore resin films 12-15 are piled thereon. At this point, the films 12-15 are piled separately from each other on the lower resin film 11, which are thermocompressed into an integral structure. That is, in the above multilayered resin film, the parts where the layers 12-15 are separate from each other are thin as compared with the other part, so that the separation parts concerned are easily deformed by heat as compared with the other part when this multilayered board is hot-pressed into an integral structure, and thus a multilayered resin film, which can be formed into an optional shape taking advantage of parts which are easily deformed by heat, can be manufactured.
Bibliography:Application Number: JP19890254011