MANUFACTURE OF NONLINEAR RESISTANCE ELEMENT
PURPOSE:To suppress the generation of a picture element defect and to improve the yield by removing a picture element electrode exposed in a pinhole after a nonlinear resistance film is laminated. CONSTITUTION:The pin hole 5 is formed possibly owing to dust, etc., when the nonlinear resistance film...
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Main Authors | , |
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Format | Patent |
Language | English |
Published |
05.01.1990
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Subjects | |
Online Access | Get full text |
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Summary: | PURPOSE:To suppress the generation of a picture element defect and to improve the yield by removing a picture element electrode exposed in a pinhole after a nonlinear resistance film is laminated. CONSTITUTION:The pin hole 5 is formed possibly owing to dust, etc., when the nonlinear resistance film 3 is formed. A substrate 1 is dipped in an etchant for etching the picture element electrode 2, and the area of the picture element electrode 2 below the pinhole 5 is etched. Then the nonlinear resistance film 3 is patterned in a desired shape, a metallic film 4 of Cr.Al, etc., is laminated by sputtering, and a row or column electrode is formed by patterning. Consequently, even if the metallic film 4 reaches the substrate 1 through the pinhole 5, it is prevented from being short-circuited to the picture element electrode 2, the defect caused by the pinhole is suppressed, and the process yield is improved. |
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Bibliography: | Application Number: JP19880135926 |