STRUCTURE OF TEMPERATURE SENSOR OF PLASMA CVD DEVICE

• Main Author: NOJI TAKAHIRO
• Format: Patent
• Language: English
• Published: 08.03.1990
• Subjects: BASIC ELECTRIC ELEMENTS; CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; MEASURING; MEASURING QUANTITY OF HEAT; MEASURING TEMPERATURE; METALLURGY; PHYSICS; SEMICONDUCTOR DEVICES; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; TESTING; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR

PURPOSE:To facilitate measurement of a substrate temp. and cooling of a heat accumulating piece having the heat time constant corresponding to a substrate to be formed with a film by connecting a sensor element to the above-mentioned heat accumulating piece and supplying a gas for cooling this heat accumulating piece via a conduit. CONSTITUTION:The substrate to be formed with the film is preheated in a vacuum heating chamber an epithermal wire heater of the plasma CVD device. The temp. sensor which detects the temps. of the above-mentioned substrate without contact therewith is disposed to a vacuum vessel 1 of this heating chamber. The temp. sensor is constituted by mounting the heat accumulating piece 10 which exhibits the heat time constant approximate to the heat time constant of the substrate in the heating chamber to the tip of a rigid pipe or bar 6 installed through the wall surface of the vacuum vessel 1 and using this piece as a member to be subjected to temp. detection by the sensor element 9. Further, the gas conduit 12 is disposed along the above-mentioned pipe or bar 6. The cooling gas is introduced through this conduit to the heat accumulating piece 10 to cool the heat accumulating piece 10 down to the temp. before the heating after the end of heating of the substrate.