MOUNTING OF SMALL SUBSTRATE

• Main Author: OKI KENICHI
• Format: Patent
• Language: English
• Published: 08.02.1990
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

PURPOSE:To eliminate solder bump formation process from a mother substrate, to shorten manufacturing process of the mother substrate, and to avoid damage in a connection section of the mother substrate and the small substrate by using a metal terminal which is manufactured in a process which is different from that of th mother substrate and the small substrate. CONSTITUTION:A metal terminal 3 is manufactured which is provided with a first C-shaped part 4 whose height sets a mounting interval between a mother substrate 1 and a small substrate 2 mounted thereon, and a second C-shaped part 5 to support the small substrate 2 thereon. the second C-shaped part 5 of a plurality of metal terminals is made to hold a first solder 7 and a solder layer 9 is formed on a specified area of the mother substrate 1. The small substrate 1 and the terminal 3 are connected by fusing the solder layer 9. Since the metal terminal thereby absorbes a stress caused by formation of a resin armor, damage in a connection section of the mother substrate and the small substrate can be avoided.