SOLDER RESIST DEVELOPING SOLUTION

• Main Authors: WATANABE ISAO, NATORI KATSUHIDE
• Format: Patent
• Language: English
• Published: 20.12.1990
• Subjects: APPARATUS SPECIALLY ADAPTED THEREFOR; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CINEMATOGRAPHY; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; ELECTROGRAPHY; HOLOGRAPHY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; MATERIALS THEREFOR; ORIGINALS THEREFOR; PHOTOGRAPHY; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES; PHYSICS; PRINTED CIRCUITS

PURPOSE:To perform highly reliable soldering without lowering developing capacity at the time of developing solder resist by adding a very small amount of sodium metavanadate to an alkaline chemical solution of a developing solution. CONSTITUTION:A very small amount of sodium metavanadate is added to an alkaline chemical solution of a developing solution. As a sample using this alkaline developing solution, a solder resist film is laminated after fusing treatment and exposed for performing developing while using a developing solution, for instance, at 40 deg.C for 4min cream solder is applied to this sample by a screen printing method and thereon the parts terminals are placed. Then, soldering is performed by a vapor phase soldering device. When the plating solder surface is given component analysis by an X-ray microanalyzer(XMA), elution of Sn is suppressed, while being the equal composition to the solder composition from the first while no alkaline developing, and addition of NaVO3 has no influence on developing capacity. Further, there is no poor junction, and cream solder performs solder junction of the parts terminals and plating solder while having no solder wetting defect.