WAFER LAMINATING APPARATUS

PURPOSE:To realize uniform and rigid adherence by applying means for forming a stripelike high temperature region on superposed wafers and sequentially transferring the regions to adjacent regions to at least any of upper and lower heaters. CONSTITUTION:A first wafer 1 and a second wafer 2 are super...

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Bibliographic Details
Main Author ARIMOTO YOSHIHIRO
Format Patent
LanguageEnglish
Published 17.12.1990
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PURPOSE:To realize uniform and rigid adherence by applying means for forming a stripelike high temperature region on superposed wafers and sequentially transferring the regions to adjacent regions to at least any of upper and lower heaters. CONSTITUTION:A first wafer 1 and a second wafer 2 are superposed on each other, and disposed between an upper heater 3 and lower heaters 41 to 48. The heaters 3, 41 to 48 are halogen lamps. Whole wafers 1, 2 superposed by the heaters 41 to 48 are heated to approx. 600 deg.C, the lamp of the heater 3 disposed at one ends of the superposed wafers 1, 2 is lit to heat it directly thereunder to 800 deg.C or higher, thereby adhering the regions. The heater 3 is moved in a direction of the arrow to extend the adhered region. Movement is advanced to the other ends of the superposed wafers 1, 2 to complete adhering.
Bibliography:Application Number: JP19890125109