MANUFACTURE OF PRINTED WIRING BOARD, AND SPUTTER DEPOSITION EQUIPMENT AND COPPER-CLAD LAMINATE THEREFOR

• Main Authors: OKI NOBUAKI, HIROBE YOSHIMICHI, TOBA RITSUJI, MIYAZAKI MASASHI, YOSHITOMI SATOSHI, KAWABE AKIHIRO
• Format: Patent
• Language: English
• Published: 17.12.1990
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; PRINTED CIRCUITS; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

PURPOSE:To reduce the decrease of copper wiring height without generating under-cut in a copper wiring pattern by uniformly forming a copper film on a base resin board by sputtering and the like, making sputter etching be anisotropic etching at the time of etching after copper-plated wiring is formed. CONSTITUTION:A resin board 1 as base material is prepared; on both surfaces 2, 2' thereof, fine unevenness is formed by sputter etching method; on both surfaces 2, 2' of the resin board 1, copper films 3, 3' are deposited by vapor- deposition or sputter deposition method; resist patterns 4, 4' are formed on both surfaces of the resin board 1 on which the copper films 3, 3' are formed; the film thickness of the patterns 4, 4' is made larger than that of a copper film to be plated in the next process; after a copper-plated patterns 5, 5' are formed, the patterns 4, 4' are eliminated by using release agent 1 the copper films 3, 3' of sputter etching deposition are eliminated by sputter etching.