INSPECTING DEVICE FOR CHIP PART MOUNTING SUBSTRATE

• Main Author: SHINAGAWA TAKAAKI
• Format: Patent
• Language: English
• Published: 14.11.1990
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; MEASURING; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS; MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS; PHYSICS; PRINTED CIRCUITS; TESTING

PURPOSE:To eliminate overlooking in inspection at a higher inspection speed by arranging a transparent sheet plate for ambient illumination of a chip part provided with an opening large enough to hold the chip part when an inspection mask is put on the chip part. CONSTITUTION:As a lever 11 for lifting substrates is lowered, a printed wiring substrate 5 rises to a position where it contacts a transparent sheet plate 4 beneath an inspection mask 3. At this point, as light from a lamp 9 is projected on the side of the sheet plate 4 through an optical fiber 8, the projection light spreads entirely through the sheet plate 4. Under such a condition, when a positional deviation occurs in the chip part 2 mounted on the substrate 5 to such a position that an end face of the part 2 is visible at an opening 7 on the mask 3 made small only corresponding to an allowable tolerance value of a positional deviation from outline dimensions of the part 2, illumination light within the sheet plate 4 leaks above the mask 3 through the opening 7. Thus, any defective point can be detected instantaneously when viewed with naked eyes from above the mask 3.