MANUFACTURE OF PRINTED BOARD

• Main Authors: WAJIMA MOTOYO, KAWAMOTO MINEO, TOBA RITSUJI, MIYAZAKI MASASHI, MURAKAMI KANJI, AKABOSHI HARUO
• Format: Patent
• Language: English
• Published: 29.10.1990
• Edition: 5
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

PURPOSE:To obtain a pattern chemical plating method through which a microcircuit can be formed by a method wherein an oxide film layer once formed or a reduced copper is etched again to make its surface roughened, and furthermore an oxide film is formed and then reduced. CONSTITUTION:A process (a) in which the surface of a copper layer formed on an insulating board is roughened, a process (b) where an oxide film is formed on the surface of the copper layer and fine irregulatities are provided, and a process (c) that the oxide film layer formed on the copper is reduced are carried out. At this point, the processes (a), (b), and (c) are carried out in the following sequence: a b a b c; or a b c a b c. Thereafter, a second metal layer is formed on the reduced surface, plating resist is formed on required points on the second metal layer, and a pattern plating is carried out onto the board. By this setup, a uniform and even surface can be obtained.