PRODUCTION OF SELF-CURABLE SOLID PHENOLIC RESIN

PURPOSE:To obtain the title resin high in softening point even with equal gelling time, narrow in molecular weight distribution, suitable as a resin for no- ammonia molding materials by condensation reaction between a phenol and formaldehyde in the presence of an organic acid divalent lead salt cata...

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Bibliographic Details
Main Authors KATAYANAGI NOBUYOSHI, NANAUMI KEN, MADARAME TAKESHI
Format Patent
LanguageEnglish
Published 03.10.1990
Subjects
CHEMISTRY
COMPOSITIONS BASED THEREON
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
THEIR PREPARATION OR CHEMICAL WORKING-UP
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Summary:PURPOSE:To obtain the title resin high in softening point even with equal gelling time, narrow in molecular weight distribution, suitable as a resin for no- ammonia molding materials by condensation reaction between a phenol and formaldehyde in the presence of an organic acid divalent lead salt catalyst. CONSTITUTION:The objective resin can be obtained by condensation reaction between (A) 1mol of a phenol and (B) 1.1-2.0 (pref. 1.2-1.8) mol in the presence of at least one kind of catalyst selected from organic acid divalent lead salts [pref. lead octanoate (lead 2-ethylhexylate) or lead cyclohexylbutyrate].
Bibliography:Application Number: JP19890068467