THERMAL HEAD

• Main Authors: NARIZUKA YASUNORI, YABUSHITA AKIRA, IKEDA SEIJI
• Format: Patent
• Language: English
• Published: 21.09.1990
• Subjects: CORRECTION OF TYPOGRAPHICAL ERRORS; i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; LINING MACHINES; PERFORMING OPERATIONS; PRINTING; SELECTIVE PRINTING MECHANISMS; STAMPS; TRANSPORTING; TYPEWRITERS

PURPOSE:To form a wiring structure having satisfactory solder bondability and to reduce a manufacturing cost by providing wirings with heat generating resistors and an IC for controlling current flow thereto on an insulating board, and forming the wirings of a thin film structure of Cr/Cr-Au/Au. CONSTITUTION:A glazed layer 2 is formed and a resistor 3 is formed by sputtering, etc., on a specific alumina board 1. Then, films are formed of metallized Cr 4 and Au 5 for wiring electrodes in necessary thicknesses by sputtering, etc., and a pattern is formed by photoetching. Thereafter, a protective layer 6 is formed by sputtering on a whole board. Subsequently, an alloy layer 7 of Cr and Ar is formed on a boundary between the Cr and the Au by heat treating. In order to form it, a resistor having stable characteristics is obtained by heat treating at the time of annealing of the resistor, and the layer 7 of the Cr and the Ar can be formed. Then, a through hole for an external connection terminal is formed with a predetermined etchant in the layer 6. When the thus obtained electrode is connected with solder 8, stable characteristics having no improper solder leakage is obtained.