HYBRID INTEGRATED CIRCUIT

PURPOSE:To enable an insulating board to be mounted with an electronic component such as a power module or the like by a method wherein the insulating board formed in such a manner that thermoplastic resin and insulating fine particles of high thermal conductivity are mixed together is used. CONSTIT...

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Bibliographic Details
Main Author YOKOMIZO YUJI
Format Patent
LanguageEnglish
Published 10.08.1990
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:PURPOSE:To enable an insulating board to be mounted with an electronic component such as a power module or the like by a method wherein the insulating board formed in such a manner that thermoplastic resin and insulating fine particles of high thermal conductivity are mixed together is used. CONSTITUTION:An insulating board 1 is formed in such a manner that thermoplastic resin 2, insulating fine particles 3 of high thermal conductivity, and others are mixed together. A conductor 4 formed in such a manner that a metal plate is patterned is proved to the board 1, and electronic components such as a chip 5 and a capacitive component are mounted on the board 1 and connected to the conductor 4. Therefore, the heat released from the electronic components mounted on the board 1 is dissipated through the ceramic fine particles 3 of high thermal conductivity inside the board 1. By this setup, an electronic component such as a power module or the like which is apt to release much heat can be mounted on an insulating board.
Bibliography:Application Number: JP19890021031