WIRE BONDING

PURPOSE:To prevent a wire from being bent near an extraction part of a capillary when the wire is cut by a method wherein a rise direction of the capillary is set in a direction of an electrode on an IC chip and at the upper part from a lead frame. CONSTITUTION:A capillary 4 which has bonded a wire...

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Bibliographic Details
Main Authors SUEMATSU MUTSUMI, OTANI KAZUMI
Format Patent
LanguageEnglish
Published 08.08.1990
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PURPOSE:To prevent a wire from being bent near an extraction part of a capillary when the wire is cut by a method wherein a rise direction of the capillary is set in a direction of an electrode on an IC chip and at the upper part from a lead frame. CONSTITUTION:A capillary 4 which has bonded a wire 3 onto a lead 2 is raised by a prescribed amount after that and is displaced by a prescribed amount [a distance (b)] in a direction of an arrow 31. Then, a clamper 5 holds the wire 3 in a displaced state; after that, the capillary 4 and the clamper 5 are raised in a direction of an electrode on an IC chip and from the lead 2. Thereby, the wire 3 can be cut without being bent.
Bibliography:Application Number: JP19890017571