FORMING FINE PATTERN

PURPOSE:To improve adhesion between a photo mask and a resist film and improve accuracy of resolution of a resist pattern and accuracy of a resist dimensions by eliminating a swelling part of the resist at the periphery part of the substrate in a substrate where the positive type resist is coated. C...

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Bibliographic Details
Main Author SONEHARA AKIO
Format Patent
LanguageEnglish
Published 18.07.1990
Subjects
APPARATUS SPECIALLY ADAPTED THEREFOR
BASIC ELECTRIC ELEMENTS
CINEMATOGRAPHY
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
ELECTROGRAPHY
HOLOGRAPHY
MATERIALS THEREFOR
ORIGINALS THEREFOR
PHOTOGRAPHY
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES
PHYSICS
SEMICONDUCTOR DEVICES
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Summary:PURPOSE:To improve adhesion between a photo mask and a resist film and improve accuracy of resolution of a resist pattern and accuracy of a resist dimensions by eliminating a swelling part of the resist at the periphery part of the substrate in a substrate where the positive type resist is coated. CONSTITUTION:When a resist 3 is coated by the spin coating method, a fringe occurs widely near the edge in the case of the square substrate 1 with a swell at the periphery of a substrate 1. Then, by selectively exposing the protruding part using a photo mask 6, etc., and then developing it layer, a part 4 where the swell is eliminated can be formed. Then, by adhering a photo mask 9 in normal manner and performing exposure by light or ionization radiant rays and then by developing it, a resist pattern 10 can be formed.
Bibliography:Application Number: JP19890003506