POSITIVE TYPE PHOTOSENSITIVE RESIN COMPOSITION

PURPOSE:To obtain the positive type photosensitive resin compsn. which is excellent in resolution and heat resistance and is good in preservable stability by consisting the compsn. of a photosensitive material and solvent which are respectively specific and incorporating the photosensitive material...

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Bibliographic Details
Main Authors KANEKO HIROYOSHI, ABIKO SHIGEO, KATAOKA MUTSUO
Format Patent
LanguageEnglish
Published 25.04.1990
Subjects
APPARATUS SPECIALLY ADAPTED THEREFOR
CINEMATOGRAPHY
ELECTROGRAPHY
HOLOGRAPHY
MATERIALS THEREFOR
ORIGINALS THEREFOR
PHOTOGRAPHY
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES
PHYSICS
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Summary:PURPOSE:To obtain the positive type photosensitive resin compsn. which is excellent in resolution and heat resistance and is good in preservable stability by consisting the compsn. of a photosensitive material and solvent which are respectively specific and incorporating the photosensitive material into the compsn. at >=20wt.% of the solid content thereof. CONSTITUTION:The photosensitive material consists of naphthoquinone-1, 2- diazide-5-sulfonyl ester or naphthoquinone-1, 2-diazide-4-sulfonyl ester of 2, 3, 4, 4'-tetrahydroxybenzophenone and the resin component consists of an alkali soluble resin. The solvent consists of the compd. expressed by the formula I and/or the mixture composed of the compds. expressed by the formulas II, III. This photosensitive material is incorporated into the compsn. at >=20wt.% of the solid content of the compsn. In the formula I to III, R1 to R3 are <=5C alkyl group. The positive type photosensitive resin compsn. which is excellent in resolution and heat resistance and is good in preservable stability is obtd. in this way.
Bibliography:Application Number: JP19880266871