RESIN MOLDING WITH WIRED STEREOSCOPIC STRUCTURE

PURPOSE:To eliminate the association of a printed circuit substrate, and to reduce the manufacturing cost of electric/electronic device by integrally molding conductive resin composition for forming the substrate in a nonconductive structure of stereoscopic construction. CONSTITUTION:This resin mold...

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Bibliographic Details
Main Author OSHITA TOSHIAKI
Format Patent
LanguageEnglish
Published 18.04.1989
Subjects
AGRICULTURE
ANIMAL HUSBANDRY
APPARATUS FOR THE DESTRUCTION OF NOXIOUS ANIMALS OR NOXIOUSPLANTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CATCHING, TRAPPING OR SCARING OF ANIMALS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
FISHING
FORESTRY
HUMAN NECESSITIES
HUNTING
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
TRAPPING
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Summary:PURPOSE:To eliminate the association of a printed circuit substrate, and to reduce the manufacturing cost of electric/electronic device by integrally molding conductive resin composition for forming the substrate in a nonconductive structure of stereoscopic construction. CONSTITUTION:This resin molding 1 is formed in a three-dimensional stereoscopic structure and integrally molded with conductive resin composition 2 and nonconductive resin composition 3. For example, the compositions 2 and 3 are respectively molded by respective extruders, and the composition 2 is associated like the conductor pattern of a printed circuit substrate in a predetermined pattern. Thus, the substrate to be mounted can be omitted or reduced.
Bibliography:Application Number: JP19870256236