MOLDING METHOD OF RESIN MOLD WITH SKIN MATERIAL

• Main Authors: TSUCHIYA KOICHI, HISATOMI SHINGO
• Format: Patent
• Language: English
• Published: 13.04.1989
• Subjects: AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING; INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES; PERFORMING OPERATIONS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR; SHAPING OR JOINING OF PLASTICS; TRANSPORTING; WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

PURPOSE:To attain a sufficient adhesive effect and cost-down of a skin material by a method wherein a number of fine holes are made on the face for bonding the skin material, a parison of a base material is deformed after the molding face with the skin material, resin to be filled in the fine holes is made to be connection cutting into the skin material. CONSTITUTION:A skin material 2 in provided with many fine holes 5 in a proper depth to the surface (face to be bonded) of a foam layer 4 before the skin material is bonded to a base material 1. In the molding process, the skin material 2 is placed on a mold 6 in one side so that the foam layer 4 side may oppose to the base material 1. Parison (the base material 1) is extruded between both molds, which are closed and air is blown thereinto to make the parison follow after the mold face to be molded. In this case, the skin material is pushed on the mold face with the expansional deformation of the parison, and is bonded on the material 1 face, resin cuts into the fine holes 5 on the foam layer 4 from the material 1 side to make 'connection foot'.