PRODUCTION OF SUBSTRATE FOR PLATED CIRCUIT FORMATION AND PRODUCTION OF WIRING BOARD USING SAID SUBSTRATE

• Main Authors: HORIBE YOSHIYUKI, UEHARA HIDEAKI, TANIGUCHI MINORU, MIMORI SEIJI, HIROYAMA YUKIHISA
• Format: Patent
• Language: English
• Published: 21.12.1989
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUSENAMELS; CHEMISTRY; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GLASS; JOINING GLASS TO GLASS OR OTHER MATERIALS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; MINERAL OR SLAG WOOL; PRINTED CIRCUITS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS,MINERALS OR SLAGS; SURFACE TREATMENT OF GLASS

PURPOSE:To enable a film metallic film to be formed by forming a phase of high SiO2 content on a glass surface containing SiO2. CONSTITUTION:A glass surface containing SiO2 is coated with a phase-splitting component capable of forming split-phase glass by reaction with the SiO2 in a glass plate (e.g., an aqueous solution containing NaHCO3 and B2O3) followed by drying and heat treatment to make a reaction between SiO2 and the phase- splitting component to effect phase splitting into a phase of greater SiO2 content and a second phase of lower SiO2 content. Thence, the resultant glass substrate is dipped into water or a dilute acid to remove the latter phase, thus obtaining the objective substrate. A conductor circuit is then plated on this substrate.