FORMING METHOD FOR MULTILAYER PRINTED BOARD

• Main Authors: UJIIE NORIAKI, MUROOKA HIDEYASU, KYOI MASAYUKI
• Format: Patent
• Language: English
• Published: 17.11.1989
• Subjects: AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PERFORMING OPERATIONS; PRINTED CIRCUITS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR; SHAPING OR JOINING OF PLASTICS; TRANSPORTING; WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

PURPOSE:To prevent interlayer voids between printed circuit boards from generating by providing an outer frame for specifying the height of a multilayer printed board, and a plunger for pressurizing a melted adhesive flowing to the periphery of a laminate. CONSTITUTION:After a laminate 4 is interpos...