FORMING METHOD FOR MULTILAYER PRINTED BOARD

• Main Authors: UJIIE NORIAKI, MUROOKA HIDEYASU, KYOI MASAYUKI
• Format: Patent
• Language: English
• Published: 17.11.1989
• Subjects: AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PERFORMING OPERATIONS; PRINTED CIRCUITS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR; SHAPING OR JOINING OF PLASTICS; TRANSPORTING; WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

PURPOSE:To prevent interlayer voids between printed circuit boards from generating by providing an outer frame for specifying the height of a multilayer printed board, and a plunger for pressurizing a melted adhesive flowing to the periphery of a laminate. CONSTITUTION:After a laminate 4 is interposed between an upper metal mold 11 and a lower metal mold 12 by using a multilayer printed board molding device having an outer frame 23 which can burden the loads of the upper and lower molds, a space surrounded by the molds 11, 12 is evacuated in vacuum, and the air of a fine space between the printed circuit board 1 of the laminate 4 and an insulation adhesive 2 is sufficiently sucked. The molds 11, 12 are heated, the adhesive 2 is melted, the melted adhesive 2' is sufficiently filled in a space surrounded by the molds 11, 12 and the frame 23 by the pressure from the molds 11, 12 side, continuously pressurized until the molds 11, 12 are brought into contact with the frame 23, and the melted adhesive is pressurized to high pressure by a plunger 24 for directly pressurizing the part in contact with the adhesive 2' of the molds 11, 12 when the thickness of the laminate 4 does not vary. Thus, the interlayer voids can be eliminated.