TOOL FOR FLEXIBLE ELECTRONIC DEVICE CARRIER AND METHOD OF USING IT

• Main Author: JIEEMUZU SUTEIBUN KANPAAMAN
• Format: Patent
• Language: English
• Published: 27.10.1989
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION ORPROCESSING OF GOODS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES; TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION; TECHNICAL SUBJECTS COVERED BY FORMER USPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS; TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINSTCLIMATE CHANGE

PURPOSE: To automate the process by removing a supporting frame while suction supporting a flexible film electronic device carrier by means of a pressure reducible fixing tool, bringing a board into contact with the carrier and then heating the lead bonding region of the carrier by means of the heater of the fixing tool. CONSTITUTION: A flexible film electronic device carrier 20 in a supporting frame 21 is set on a fixing tool 10 while mounting an electronic device 22. The flexible film carrier is then sucked while directing the opposite side of the electronic device 22 on the carrier 20 having bonding pads 23 toward the fixing tool 10 thus holding electronic device in the recess of the fixing tool. Subsequently, the supporting frame is removed from the flexible film carrier using a die and a decurl 20 is pressed against a board 24. At the same time, the lead bonding region is heated by means of a heating coil 16 in order to reflow the solder thus bonding the board and the carrier. Finally, the vacuum is released and the fixing tool is drawn up. According to the method, the carrier can be removed from the supporting frame before the flexible film electronic device carrier 20 is bonded to the board.