ELECTROLESS PALLADIUM PLATING BATH

• Main Authors: NAWAFUNE HIDEMI, MIZUMOTO SHOZO, HAGA MASAKI, UCHIDA MAMORU
• Format: Patent
• Language: English
• Published: 26.10.1989
• Subjects: CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

PURPOSE:To obtain the title plating bath having moderate deposition rate and excellent in stability by providing an aqueous solution which contains respectively prescribed concentrations of Pd compound, NH3 or/and amine compound, organic compound containing bivalent S, and phosphorous acid or salts thereof. CONSTITUTION:The above electroless Pd plating bath is formed of an aqueous solution which contains 0.0001-0.5mole/l Pd compound, 0.001-8mole/l NH3 or/and amine compound, 1-50mg/l organic compound containing bivalent S, and 0.005-2mole/l phosphorous acid or salts thereof. As the above Pd compound, palladium chloride, etc., are used. Further, e.g., monoamines, such as methylamine, are used as the above amine, and, as the above S-containing organic compound, (CH3)3CSH, etc., are used, respectively. The above plating bath requires the use of NH3 and/or amine compound in combination with S-containing organic compound as essential requirements and is a plating bath extremely excellent in stability and suitable for use on an industrial scale.