PRINTED WIRING BOARD

PURPOSE:To remove solder bridge between a termination pad and the preceding pad by providing a row of pads corresponding to leads of electronic components in the direction in which solder jet waves propagates and further by providing a pad for preventing solder bridges in the back of the termination...

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Bibliographic Details
Main Author FUKUI KIYOSHI
Format Patent
LanguageEnglish
Published 17.10.1989
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:PURPOSE:To remove solder bridge between a termination pad and the preceding pad by providing a row of pads corresponding to leads of electronic components in the direction in which solder jet waves propagates and further by providing a pad for preventing solder bridges in the back of the termination pad which is brought into no contact with the solder flow at the time of soldering. CONSTITUTION:When a printed wiring board 1 is moved in the direction of the arrow A to be soldered by wave soldering against jet waves, a pad 1a-9 for preventing solder bridges, which is not connected to a wiring board, having nearly the same pitch and nearly the same area as a termination pad 1a-8 is provided in the back of the termination pad 1a-8 where the contact with jet waves is cut. Therefore, the position at which the contact with jet waves is made is shifted far toward the back and a surface tension acts between the termination pad 1a-8 and the pad 1a-9 for prevention of solder bridges. As a result of this, the surface tension between the termination pad 1a-8 and the pad 1a-7 just preceding it is cut and solder bridges can be prevented.
Bibliography:Application Number: JP19880087801