MANUFACTURE OF SEMICONDUCTOR DEVICE

• Main Author: KOIKE MICHIO
• Format: Patent
• Language: English
• Published: 02.10.1989
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

PURPOSE:To assure the stable specified dimensions for enhancing the reliability and the massproductivity by a method wherein a dummy pattern is arranged before performing an etching process on a processed surface even in a chip or between different type semiconductor devices. CONSTITUTION:When an isolated circuit pattern 1 and another circuit pattern 1 with rough and dense parts are formed by photoetching process using a photoresist, a dummy pattern is arranged on a processing surface. Thus, the difference in the roughness and denseness of the circuit pattern 1 is restricted to make the pattern dimension in the same chip almost equal causing no disconnection. Furthermore, when a memory IC with the difference in roughness and denseness and a logic array IC are dry-etched between different type semiconductor devices, if the dummy pattern is provided to equalize the density thereof with that of the circuit pattern of the memory IC, the dimensional conversion difference and the dispersion can be restrained. Through these procedures, the patterns can be assured of the stable specified dimension to enhance the reliability and the massproductivity.