CIRCUIT BOARD

PURPOSE:To improve the breakdown strength of an electric circuit having an organic polymer insulating layer by coating the edges of an electric circuit layer with a semiconductive material and further providing an organic high polymer insulating layer on the semiconductive material coated layer. CON...

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Bibliographic Details
Main Authors KATSUO RYUJI, OKAWA KOJI, YOSHIOKA MICHIHIKO
Format Patent
LanguageEnglish
Published 18.09.1989
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:PURPOSE:To improve the breakdown strength of an electric circuit having an organic polymer insulating layer by coating the edges of an electric circuit layer with a semiconductive material and further providing an organic high polymer insulating layer on the semiconductive material coated layer. CONSTITUTION:An organic high polymer insulating layer 2 is formed on a metal substrate and on this layer there is formed an electric circuit layer 3. An edge portion 31 and a side surface 32 of the electric circuit layer 3 are coated by a coating layer 4 composed of a semiconductive material. On the coating layer 4 an organic high polymer insulating layer 5 is coated. By coating the edges 31 of the electric circuit layer by the semiconductive material, the concentration of electric field on these portions can be reduced. Further, by providing the organic high polymer insulating layer 5 on the coating layer 4 coated by the semiconductive material, the breakdown strength on the edge portions can be increased, whereby the generation of corona can be suppressed even under high voltages. This ensures that the breakdown strength of this circuit board is increased compared to the conventional circuit boards.
Bibliography:Application Number: JP19880059103