COPPER ELECTROPLATING SOLUTION

PURPOSE:To obtain a poisonless copper electroplating soln. having superior throwing power and depositing a film having satisfactory physical properties by preparing an aq. soln. contg. specified amts. of a copper compd., a specified compd. as a chelating agent and pyrophosphoric acid. CONSTITUTION:A...

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Bibliographic Details
Main Authors NAWAFUNE HIDEMI, MIZUMOTO SHOZO, SHIMIZU YOSHIJI, HAGA MASAKI, UCHIDA MAMORU
Format Patent
LanguageEnglish
Published 01.09.1989
Subjects
APPARATUS THEREFOR
CHEMISTRY
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
METALLURGY
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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Summary:PURPOSE:To obtain a poisonless copper electroplating soln. having superior throwing power and depositing a film having satisfactory physical properties by preparing an aq. soln. contg. specified amts. of a copper compd., a specified compd. as a chelating agent and pyrophosphoric acid. CONSTITUTION:An aq. soln. contg. 0.01-1mol./l copper compd., 0.01-2mol./l chelating agent and 0.006-1mol./l one or more among pyrophosphoric acid, a salt thereof, 2,2'-dipyridyl, 1,10-phenanthroline, NaCN and Na4Fe(CN)6 is prepd. to obtain a copper electroplating soln. for plating through holes. The chelating agent is a compd. represented by general formula I (where X1 is H or -COOM4, X2 is -COOM3 or -CH2CH2OH, n is an integer of 0-2 and each of M1-M5 is H, Na, K or NH4) and/or a compd. represented by general formula II (where X3 is H, -CH2COOM6, -CH2CH2COOM7 or -CH2CH2OH, X4 is -CH2 COOM8, -CH2CH2COOM9 or -CH2CH2OH, X5 is -CH2COOM10, -CH2CH2COOM11, -CH2CH2OH and each of M6-M11 is H, Na, K or NH4).
Bibliography:Application Number: JP19880043552