VACUUM CHAMBER COOLING METHOD

PURPOSE:To efficiently, rapidly and economically cool each adsorbing member by connecting a plurality of He cooling system differing in capacity in parallel to a common He circulation supply system while cooling sequentially each adsorbing member with each He cooling system. CONSTITUTION:A first He...

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Bibliographic Details
Main Authors MUROO YOUJI, SHIKI NORIAKI, YAMADA KANEO, AKAMATSU MASAAKI, TOKUSHIGE KEIZO
Format Patent
LanguageEnglish
Published 30.08.1989
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Summary:PURPOSE:To efficiently, rapidly and economically cool each adsorbing member by connecting a plurality of He cooling system differing in capacity in parallel to a common He circulation supply system while cooling sequentially each adsorbing member with each He cooling system. CONSTITUTION:A first He cooling system I is provided with a heat change type precooling mechanism Ia and a variable capacity type expanding mechanism Ib to cool a first adsorbing member Ic to a low temperature. Also, a second He cooling system II is provided with a higher capacity heat exchange type precooling mechanism IIa and a variable capacity type expanding mechanism IIb to cool a second adsorbing member IIc to a lower temperature. Then, the respective He cooling systems I, II are connected respectively in parallel to a common circulation supply system. The cooling action of the first He cooling mechanism I precedes that of the second one to cool the first adsorbing member Ic to the low temperature earlier. When then the second adsorbing member IIc is cooled to lower temperature, the capacity of the variable capacity expanding mechanism IIb is increased to increase an coldness generating amount and shorten a time taken for cooling to lower temperature.
Bibliography:Application Number: JP19880043933