PHOTOSETTING TYPE RESIST RESIN COMPOSITION FOR CHEMICAL PLATING
PURPOSE:To improve printability and to enable the formation of high-density circuits by incorporating a multifunctional epoxy resin, liquid polybutadiene resin and/or hydrogenated liquid polybutadiene resin and photo-cation polymn. initiator into the compsn. CONSTITUTION:This compsn. contains the ep...
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Main Authors | , , , , |
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Format | Patent |
Language | English |
Published |
23.08.1989
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Subjects | |
Online Access | Get full text |
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Abstract | PURPOSE:To improve printability and to enable the formation of high-density circuits by incorporating a multifunctional epoxy resin, liquid polybutadiene resin and/or hydrogenated liquid polybutadiene resin and photo-cation polymn. initiator into the compsn. CONSTITUTION:This compsn. contains the epoxy resin which has at least two glycidyl ether groups in 1mol. and in which the glycidyl groups are directly bonded to an arom. ring or cyclohexane ring (component A), the liquid polybutadiene resin and/or hydrogenated liquid polybutadiene resin (component B) and a photosensitive arom. onium salt (component C). The component A has an excellent photosetting property and forms a tough resist film having a large crosslinking density. The component B improves the surface condition as a defoaming agent and leveling agent on the ink surface. The component C initiates the polymn. of the resin compsn. The high-density printing pattern having the excellent printing characteristics is thereby obtd. |
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AbstractList | PURPOSE:To improve printability and to enable the formation of high-density circuits by incorporating a multifunctional epoxy resin, liquid polybutadiene resin and/or hydrogenated liquid polybutadiene resin and photo-cation polymn. initiator into the compsn. CONSTITUTION:This compsn. contains the epoxy resin which has at least two glycidyl ether groups in 1mol. and in which the glycidyl groups are directly bonded to an arom. ring or cyclohexane ring (component A), the liquid polybutadiene resin and/or hydrogenated liquid polybutadiene resin (component B) and a photosensitive arom. onium salt (component C). The component A has an excellent photosetting property and forms a tough resist film having a large crosslinking density. The component B improves the surface condition as a defoaming agent and leveling agent on the ink surface. The component C initiates the polymn. of the resin compsn. The high-density printing pattern having the excellent printing characteristics is thereby obtd. |
Author | KAWAMOTO MINEO HARUTA HIROYUKI TSUDA HIDEO MORIKAWA TAKAO MURAKAMI KANJI |
Author_xml | – fullname: TSUDA HIDEO – fullname: HARUTA HIROYUKI – fullname: MORIKAWA TAKAO – fullname: KAWAMOTO MINEO – fullname: MURAKAMI KANJI |
BookMark | eNrjYmDJy89L5WSwD_DwD_EPdg0J8fRzVwiJDHBVCHIN9gwOAVN-Cs7-vgH-wZ4hnv5-Cm7-QQrOHq6-ns6OPgoBPo4gLTwMrGmJOcWpvFCam0HRzTXE2UM3tSA_PrW4IDE5NS-1JN4rwMPA0MjA0sTE0NGYGDUA094stQ |
ContentType | Patent |
DBID | EVB |
DatabaseName | esp@cenet |
DatabaseTitleList | |
Database_xml | – sequence: 1 dbid: EVB name: esp@cenet url: http://worldwide.espacenet.com/singleLineSearch?locale=en_EP sourceTypes: Open Access Repository |
DeliveryMethod | fulltext_linktorsrc |
Discipline | Medicine Chemistry Sciences Physics |
ExternalDocumentID | JPH01209441A |
GroupedDBID | EVB |
ID | FETCH-epo_espacenet_JPH01209441A3 |
IEDL.DBID | EVB |
IngestDate | Fri Jul 19 11:55:36 EDT 2024 |
IsOpenAccess | true |
IsPeerReviewed | false |
IsScholarly | false |
Language | English |
LinkModel | DirectLink |
MergedId | FETCHMERGED-epo_espacenet_JPH01209441A3 |
Notes | Application Number: JP19880033932 |
OpenAccessLink | https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19890823&DB=EPODOC&CC=JP&NR=H01209441A |
ParticipantIDs | epo_espacenet_JPH01209441A |
PublicationCentury | 1900 |
PublicationDate | 19890823 |
PublicationDateYYYYMMDD | 1989-08-23 |
PublicationDate_xml | – month: 08 year: 1989 text: 19890823 day: 23 |
PublicationDecade | 1980 |
PublicationYear | 1989 |
RelatedCompanies | NIPPON SODA CO LTD HITACHI LTD |
RelatedCompanies_xml | – name: HITACHI LTD – name: NIPPON SODA CO LTD |
Score | 2.394861 |
Snippet | PURPOSE:To improve printability and to enable the formation of high-density circuits by incorporating a multifunctional epoxy resin, liquid polybutadiene resin... |
SourceID | epo |
SourceType | Open Access Repository |
SubjectTerms | ADHESIVES APPARATUS SPECIALLY ADAPTED THEREFOR AUXILIARY PROCESSES IN PHOTOGRAPHY CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMICAL PAINT OR INK REMOVERS CHEMISTRY CINEMATOGRAPHY COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS COMPOSITIONS BASED THEREON CORRECTING FLUIDS DYES ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY FILLING PASTES HOLOGRAPHY INKS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MATERIALS THEREFOR METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS ORGANIC MACROMOLECULAR COMPOUNDS ORIGINALS THEREFOR PAINTS PASTES OR SOLIDS FOR COLOURING OR PRINTING PHOTOGRAPHIC PROCESSES, e.g. CINE, X-RAY, COLOUR,STEREO-PHOTOGRAPHIC PROCESSES PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHOTOSENSITIVE MATERIALS FOR PHOTOGRAPHIC PURPOSES PHYSICS POLISHES PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS THEREFOR WOODSTAINS |
Title | PHOTOSETTING TYPE RESIST RESIN COMPOSITION FOR CHEMICAL PLATING |
URI | https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19890823&DB=EPODOC&locale=&CC=JP&NR=H01209441A |
hasFullText | 1 |
inHoldings | 1 |
isFullTextHit | |
isPrint | |
link | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV3dS8MwED_m_HzT6dD5QQTpW7HYD7eHMra2sxuuDTbKfBpNG0EfuuEq_vteYut80afAhRzhyC_3kbsLwFVX3Bi8m6e6bXJ0UDKR6dwwU93kvIcHxESnSwb0p5ETPlqTmT1rwFtdC6P6hH6q5oiIqAzxXqr7erkOYvkqt3J1zV-RtOiPmOtreVql_8iHI80fugGN_djTPM-dUC16cENVJIq6f7ABm2hG30o0BE9DWZWy_K1SRvuwRZFbUR5AQxQt2PXqn9dasDOtHrxbsK0yNLMVEisUrg6hT8OYxUnA2Di6I-yZBgTlOE6YGiLixVMaJ2MZfCLo5JG67QGh9wO55AguRwHzQh33NP8RwHxC19s329AsFoU4BiJ711kOt7P8xbG4nado_AmOIBNpz3KEOIHO33w6_02ewt53LlVXN40zaJbvH-IclW_JL5TUvgArlIMz |
link.rule.ids | 230,309,783,888,25576,76876 |
linkProvider | European Patent Office |
linkToHtml | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV3dT8IwEL8gfuCbokbxqyZmb4vEfQgPC4FtuCHbGqkGnsi61UQfBpEZ_32vFcQXfWpyTS_Npb_eR--uANctcdvkrTzVLYOjg5KJTOdNI9UNztt4QAx0umRAP4rt4MkcjK1xBd5WtTCqT-inao6IiMoQ76W6r-frIJancisXN_wVSbNOnzmelqfL9B_5cKR5PceniZe4mus6A6rFj06gikRR93c3YBNN7DuJBv-5J6tS5r9VSn8PtihyK8p9qIiiDjV39fNaHXai5YN3HbZVhma2QOIShYsD6NAgYcnIZyyM7wmbUJ-gHMMRU0NM3CSiySiUwSeCTh5ZtT0gdNiVSw7hqu8zN9BxT9MfAUwHdL194wiqxawQx0Bk7zrT5laWv9gmt_IUjT_BEWQibZu2ECfQ-JtP47_JS6gFLBpOh2H8cAq733lViCjjDKrl-4c4R0Vc8gslwS995YYo |
openUrl | ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Apatent&rft.title=PHOTOSETTING+TYPE+RESIST+RESIN+COMPOSITION+FOR+CHEMICAL+PLATING&rft.inventor=TSUDA+HIDEO&rft.inventor=HARUTA+HIROYUKI&rft.inventor=MORIKAWA+TAKAO&rft.inventor=KAWAMOTO+MINEO&rft.inventor=MURAKAMI+KANJI&rft.date=1989-08-23&rft.externalDBID=A&rft.externalDocID=JPH01209441A |