PHOTOSETTING TYPE RESIST RESIN COMPOSITION FOR CHEMICAL PLATING

PURPOSE:To improve printability and to enable the formation of high-density circuits by incorporating a multifunctional epoxy resin, liquid polybutadiene resin and/or hydrogenated liquid polybutadiene resin and photo-cation polymn. initiator into the compsn. CONSTITUTION:This compsn. contains the ep...

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Main Authors TSUDA HIDEO, HARUTA HIROYUKI, MORIKAWA TAKAO, KAWAMOTO MINEO, MURAKAMI KANJI
Format Patent
LanguageEnglish
Published 23.08.1989
Subjects
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Abstract PURPOSE:To improve printability and to enable the formation of high-density circuits by incorporating a multifunctional epoxy resin, liquid polybutadiene resin and/or hydrogenated liquid polybutadiene resin and photo-cation polymn. initiator into the compsn. CONSTITUTION:This compsn. contains the epoxy resin which has at least two glycidyl ether groups in 1mol. and in which the glycidyl groups are directly bonded to an arom. ring or cyclohexane ring (component A), the liquid polybutadiene resin and/or hydrogenated liquid polybutadiene resin (component B) and a photosensitive arom. onium salt (component C). The component A has an excellent photosetting property and forms a tough resist film having a large crosslinking density. The component B improves the surface condition as a defoaming agent and leveling agent on the ink surface. The component C initiates the polymn. of the resin compsn. The high-density printing pattern having the excellent printing characteristics is thereby obtd.
AbstractList PURPOSE:To improve printability and to enable the formation of high-density circuits by incorporating a multifunctional epoxy resin, liquid polybutadiene resin and/or hydrogenated liquid polybutadiene resin and photo-cation polymn. initiator into the compsn. CONSTITUTION:This compsn. contains the epoxy resin which has at least two glycidyl ether groups in 1mol. and in which the glycidyl groups are directly bonded to an arom. ring or cyclohexane ring (component A), the liquid polybutadiene resin and/or hydrogenated liquid polybutadiene resin (component B) and a photosensitive arom. onium salt (component C). The component A has an excellent photosetting property and forms a tough resist film having a large crosslinking density. The component B improves the surface condition as a defoaming agent and leveling agent on the ink surface. The component C initiates the polymn. of the resin compsn. The high-density printing pattern having the excellent printing characteristics is thereby obtd.
Author KAWAMOTO MINEO
HARUTA HIROYUKI
TSUDA HIDEO
MORIKAWA TAKAO
MURAKAMI KANJI
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HITACHI LTD
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Snippet PURPOSE:To improve printability and to enable the formation of high-density circuits by incorporating a multifunctional epoxy resin, liquid polybutadiene resin...
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SourceType Open Access Repository
SubjectTerms ADHESIVES
APPARATUS SPECIALLY ADAPTED THEREFOR
AUXILIARY PROCESSES IN PHOTOGRAPHY
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CHEMICAL PAINT OR INK REMOVERS
CHEMISTRY
CINEMATOGRAPHY
COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS
COMPOSITIONS BASED THEREON
CORRECTING FLUIDS
DYES
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
ELECTROGRAPHY
FILLING PASTES
HOLOGRAPHY
INKS
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
MATERIALS THEREFOR
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
ORGANIC MACROMOLECULAR COMPOUNDS
ORIGINALS THEREFOR
PAINTS
PASTES OR SOLIDS FOR COLOURING OR PRINTING
PHOTOGRAPHIC PROCESSES, e.g. CINE, X-RAY, COLOUR,STEREO-PHOTOGRAPHIC PROCESSES
PHOTOGRAPHY
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES
PHOTOSENSITIVE MATERIALS FOR PHOTOGRAPHIC PURPOSES
PHYSICS
POLISHES
PRINTED CIRCUITS
THEIR PREPARATION OR CHEMICAL WORKING-UP
USE OF MATERIALS THEREFOR
WOODSTAINS
Title PHOTOSETTING TYPE RESIST RESIN COMPOSITION FOR CHEMICAL PLATING
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