PHOTOSETTING TYPE RESIST RESIN COMPOSITION FOR CHEMICAL PLATING

PURPOSE:To improve printability and to enable the formation of high-density circuits by incorporating a multifunctional epoxy resin, liquid polybutadiene resin and/or hydrogenated liquid polybutadiene resin and photo-cation polymn. initiator into the compsn. CONSTITUTION:This compsn. contains the ep...

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Bibliographic Details
Main Authors TSUDA HIDEO, HARUTA HIROYUKI, MORIKAWA TAKAO, KAWAMOTO MINEO, MURAKAMI KANJI
Format Patent
LanguageEnglish
Published 23.08.1989
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Summary:PURPOSE:To improve printability and to enable the formation of high-density circuits by incorporating a multifunctional epoxy resin, liquid polybutadiene resin and/or hydrogenated liquid polybutadiene resin and photo-cation polymn. initiator into the compsn. CONSTITUTION:This compsn. contains the epoxy resin which has at least two glycidyl ether groups in 1mol. and in which the glycidyl groups are directly bonded to an arom. ring or cyclohexane ring (component A), the liquid polybutadiene resin and/or hydrogenated liquid polybutadiene resin (component B) and a photosensitive arom. onium salt (component C). The component A has an excellent photosetting property and forms a tough resist film having a large crosslinking density. The component B improves the surface condition as a defoaming agent and leveling agent on the ink surface. The component C initiates the polymn. of the resin compsn. The high-density printing pattern having the excellent printing characteristics is thereby obtd.
Bibliography:Application Number: JP19880033932