CONTACT TYPE IMAGE SENSOR

PURPOSE:To simplify manufacturing process, and reduce the permeation of external noise, by dividing a photosensor element array, and arranging the divided photosensor element groups on bear chip ICs for driving. CONSTITUTION:On a plurality of bear chips ICs 10 to drive a photosensor element array, a...

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Bibliographic Details
Main Authors NAGAHIRO NORIO, MISHIMA YASUYOSHI
Format Patent
LanguageEnglish
Published 24.07.1989
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC COMMUNICATION TECHNIQUE
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
PICTORIAL COMMUNICATION, e.g. TELEVISION
SEMICONDUCTOR DEVICES
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Summary:PURPOSE:To simplify manufacturing process, and reduce the permeation of external noise, by dividing a photosensor element array, and arranging the divided photosensor element groups on bear chip ICs for driving. CONSTITUTION:On a plurality of bear chips ICs 10 to drive a photosensor element array, a plurality of photosensor elements 11 are respectively arranged in a row. On a flexible printed board 12 on which a matrix type wiring 13 for signal processing is previously formed, a plurality of the driving bear chip ICs 10 are so mounted that the elements 11 are arranged in a row. The ICs 10 and the wiring 13 are connected with bonding wires 14. Thus it is unnecessitated to form a large-sized photosensor element array of single body, so that the manufacturing process is simplified, and the permeation of external noise can be reduced.
Bibliography:Application Number: JP19880003890