RELEASING METHOD FOR RESIN MOLDED PRODUCT

PURPOSE:To release easily without damaging recessed and projected sections of a surface by quenching and releasing a surface not being in contact with a mold from which a resin molded product is released when the resin molded product with recessed and projected sections on its surface is released. C...

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Bibliographic Details
Main Authors AMANO YASUO, YOSHII MASAKI, UEDA KOJI, UEDA MASANOBU
Format Patent
LanguageEnglish
Published 14.06.1989
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Summary:PURPOSE:To release easily without damaging recessed and projected sections of a surface by quenching and releasing a surface not being in contact with a mold from which a resin molded product is released when the resin molded product with recessed and projected sections on its surface is released. CONSTITUTION:For example, when a Fresnel lens is released from a mold, liquid nitrogen 12 jetting out of a jetting nozzle 7 is hit on an outer periphery of a surface opposing to a prism transfer surface of a molded Fresnel lens 3 and the section hit by liquid nitrogen is quenched. Then, while the jetting nozzle 7 is moved from the outer periphery to a central section on a couple of rails 11 placed on a bottom force 2 as a base and disposed on the upper section of the Fresnel lens 3, ejecting pins 5 and 6 are lifted up and the Fresnel lens 3 is released from a mold 4. In other words, part of an upper surface 3a is shrinked suddenly by quenching the outer periphery of the Fresnel lens 3 adhered closely to the mold 4. On the other hand, as a lower surface 3b adhered to the mold 4 retains the mold temperature, a temperature difference is generated between the upper surface 3a and the lower surface 3b, and a large local shrinkage 17 is generated on the upper surface 3a.
Bibliography:Application Number: JP19870294047