QUICK-CURING EPOXY RESIN COMPOSITION

PURPOSE:To obtain the title composition rapidly curable even without increasing the amount of a curing accelerator and capable of providing cured products without deteriorating heat resistance, by reacting a blend of respective specific two kinds of epoxy resins with (tetrabromo)bisphenols. CONSTITU...

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Bibliographic Details
Main Author HARADA TAIRA
Format Patent
LanguageEnglish
Published 06.06.1989
Subjects
CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
THEIR PREPARATION OR CHEMICAL WORKING-UP
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Summary:PURPOSE:To obtain the title composition rapidly curable even without increasing the amount of a curing accelerator and capable of providing cured products without deteriorating heat resistance, by reacting a blend of respective specific two kinds of epoxy resins with (tetrabromo)bisphenols. CONSTITUTION:The aimed composition obtained by blending an epoxy resin, prepared by reacting hydroquinone with epichlorohydrin and consisting essentially of hydroquinone type diglycidyl ether with an epoxy resin, obtained by reacting bisphenols with epichlorohydrin and consisting essentially of a bisphenol type diglycidyl ether at 50:50-1:99 weight ratio, adding and blending the resultant blend with bisphenols and/or tetrabromobisphenols preferably at 1.5:1-5:1 equivalent ratio of epoxy groups in the blend to phenolic hydroxyl groups in the (tetrabromo)bisphenols.
Bibliography:Application Number: JP19870303890