METHOD FOR BONDING POROUS CERAMIC TO METAL

PURPOSE:To firmly bond a porous ceramic to a metal without producing cracking, etc., by interposing a ceramic having about the same thermal expansion coefficient as the porous ceramic and higher strength between the bonding surfaces. CONSTITUTION:A ceramic 20 (e.g., high-strength alumina ceramics) h...

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Bibliographic Details
Main Authors OKAMOTO AKIRA, ENOKIDO TSUNEO
Format Patent
LanguageEnglish
Published 02.06.1989
Subjects
ARTIFICIAL STONE
CEMENTS
CERAMICS
CHEMISTRY
CLADDING OR PLATING BY SOLDERING OR WELDING
COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDINGMATERIALS
CONCRETE
CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING
LIME, MAGNESIA
MACHINE TOOLS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
METALLURGY
PERFORMING OPERATIONS
REFRACTORIES
SLAG
SOLDERING OR UNSOLDERING
TRANSPORTING
TREATMENT OF NATURAL STONE
WELDING
WORKING BY LASER BEAM
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Summary:PURPOSE:To firmly bond a porous ceramic to a metal without producing cracking, etc., by interposing a ceramic having about the same thermal expansion coefficient as the porous ceramic and higher strength between the bonding surfaces. CONSTITUTION:A ceramic 20 (e.g., high-strength alumina ceramics) having a thermal expansion coefficient equivalent or similar to that of a porous ceramic 1 (e.g., porous alumina ceramics) and higher strength than the ceramic 1 is interposed between the ceramic 1 and a metal 3 (e.g., copper sheet). In this case, the porous ceramic 1 is firstly bonded to the ceramic 20, and then the ceramic 20 is bonded to the metal 3. As a result, thermal stress is not developed between the porous ceramic 1 and the ceramic 20 during the bonding, and the thermal stress developed between the ceramic 20 and the metal 3 is absorbed by the high-strength ceramic 20.
Bibliography:Application Number: JP19870296234