WIRE BONDING APPARATUS

• Main Authors: TAKASHIMA KAZUHISA, ARIGA MAKOTO, YAMAZAKI ISAMU
• Format: Patent
• Language: English
• Published: 01.06.1989
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES; MEASURING; PHYSICS; SEMICONDUCTOR DEVICES; TESTING

PURPOSE:To execute a wire bonding operation while an automatic inspection is being carried out without lowering a production capacity by installing the following: a pattern recognition part; an image memory which can memorize an image of a pressure-bonded part after a bonding operation in connection with a wire number and the pressure-bonded part. CONSTITUTION:A pattern recognition part and a bonding control part are equipped with separate central processing units (CPU's) 18, 20; in the pattern recognition part, an image memory 12 used to temporarily memorize an image of an object to be inspected is constituted. Accordingly, immediately after a wire bonding operation or after the completion of a whole bonding operation for one IC, an image of a bonding part is stored in the memory 12 in conjunction with the bonding control part; an inspection is carried out during a next wire bonding operation or during the bonding operation of the IC and during a transfer duration of the IC and in parallel with an operation of a wire bonding mechanism 6. By this setup, the effective bonding operation due to a parallel operation can be achieved.