REDUCTION STEPPER

PURPOSE:To achieve a highly accurate superposition by detecting a number of position detecting patterns within a wafer, by performing distribution processing to check whether the obtained detection data are correct or not, and by extracting only the correct detected data. CONSTITUTION:A pattern on a...

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Bibliographic Details
Main Authors NUMATA MITSUHIRO, TSUYUKI HISAMASA
Format Patent
LanguageEnglish
Published 26.05.1989
Subjects
APPARATUS SPECIALLY ADAPTED THEREFOR
BASIC ELECTRIC ELEMENTS
CINEMATOGRAPHY
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
ELECTROGRAPHY
HOLOGRAPHY
MATERIALS THEREFOR
ORIGINALS THEREFOR
PHOTOGRAPHY
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES
PHYSICS
SEMICONDUCTOR DEVICES
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Summary:PURPOSE:To achieve a highly accurate superposition by detecting a number of position detecting patterns within a wafer, by performing distribution processing to check whether the obtained detection data are correct or not, and by extracting only the correct detected data. CONSTITUTION:A pattern on a water 4 is led to a pattern detection system 5 through a reduction lens 3, and relative positions of a reticle 2 and a chip within a wafer are detected to be processed by a data processing device 6. After processing the data, relative matching of the reticle 2 and the chip within the wafer 4 is performed. A large number of chips are detected, and detected data are judged whether the detected data are correct or not using a statistic processing such as the distribution processing, and only the correct detection data are extracted for X and Y axes independently. Furthermore, since relative matching is performed with only the extracted detection data, superposition accuracy of each chip within wafer is improved.
Bibliography:Application Number: JP19870292128