SEMICONDUCTOR DEVICE

PURPOSE:To acquired a semiconductor device whose low cost construction an protect an IC by fixing an IC pellet in the rear side of a die island and by screening physical effect from the front side of the semiconductor device by the die island. CONSTITUTION:Granting that the rear side of a semiconduc...

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Bibliographic Details
Main Author ASAMI TAKAO
Format Patent
LanguageEnglish
Published 22.05.1989
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PURPOSE:To acquired a semiconductor device whose low cost construction an protect an IC by fixing an IC pellet in the rear side of a die island and by screening physical effect from the front side of the semiconductor device by the die island. CONSTITUTION:Granting that the rear side of a semiconductor device is the side whereon a lead 40 is connected to a printed board and the front side is the opposite thereof, an IC pellet 1 is protected against the physical effect from the front side of the semiconductor through a die island 2 by fixing the IC pellet 1 to the rear side of the die island 2. The IC pellet 1 of a resin-sealed flat package type semiconductor device can be thus protected against the physical effect from the front side of the semiconductor by this simple construction.
Bibliography:Application Number: JP19870284237