亜鉛を主成分として、アルミニウムを合金化金属として含む鉛フリー共晶はんだ合金

Lead-free solder alloy comprising zinc (Zn) as the main component and aluminum (Al) as an alloying metal, wherein the solder alloy is a eutectic having a single melting point in the range of 320 to 390 °C (measured by DSC at a heating rate of 5 °C min -1 ), wherein the lead-free solder alloy compris...

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Bibliographic Details
Main Authors LEMARCHAND, Kevin Morgane, CHARIER, Gilles Alain Marie
Format Patent
LanguageJapanese
Published 14.11.2018
Subjects
ALLOYS
CHEMISTRY
CLADDING OR PLATING BY SOLDERING OR WELDING
CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING
FERROUS OR NON-FERROUS ALLOYS
MACHINE TOOLS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
METALLURGY
PERFORMING OPERATIONS
SOLDERING OR UNSOLDERING
TRANSPORTING
TREATMENT OF ALLOYS OR NON-FERROUS METALS
WELDING
WORKING BY LASER BEAM
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Summary:Lead-free solder alloy comprising zinc (Zn) as the main component and aluminum (Al) as an alloying metal, wherein the solder alloy is a eutectic having a single melting point in the range of 320 to 390 °C (measured by DSC at a heating rate of 5 °C min -1 ), wherein the lead-free solder alloy comprises 6.0 wt.% of aluminum (Al) and 6.0 to 7.2 wt.% of germanium (Ge).
Bibliography:Application Number: JP20160560991