フラックス

• Format: Patent
• Language: Japanese
• Published: 30.05.2018
• Subjects: CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; PERFORMING OPERATIONS; SOLDERING OR UNSOLDERING; TRANSPORTING; WELDING; WORKING BY LASER BEAM

【課題】シリコンウェハに形成された保護膜の変色、膨潤及び、シリコンウェハからの剥離を抑制することが可能なフラックスを提供する。【解決手段】フラックスは、ジグリセリンにエチレンオキサイドが付加重合されたジグリセリンＥＯ付加物、ジグリセリンにプロピレンオキサイドが付加重合されたジグリセリンＰＯ付加物、グリセリンにエチレンオキサイド及びプロピレンオキサイドが付加重合されたグリセリンＥＯ／ＰＯ付加物の何れか、または、２種以上の組み合わせから選択される溶剤を、３０質量％以上１００質量％未満、活性剤を、０質量％超５０質量％以下で含む。【選択図】無し The subject of the present invention is to provide a soldering flux capable of suppressing the discoloration and swelling of a protective film formed on a silicon wafer and the peeling of the same from the silicon wafer. To solve the problem, the soldering flux comprises: more than 30% by mass and less than 100% by mass of solvent selected from any one of di-glycerin EO adduct obtained by addition polymerization of ethylene oxide to di-glycerin, di-glycerin PO adduct obtained by addition polymerization of propylene oxide to di-glycerin, and glycerin EO/PO adduct obtained by addition polymerization of ethylene oxide and propylene oxide to glycerin, or a combination of more than two of the adducts; and more than 0% by mass and less than 50% by mass of active agent.