JP2992427B

The present invention provides an apparatus and its method that is able to effectively use positional data such as coordinates and so forth stored in advance in a bonder. A first or second bonding point in the form of bonded sites is photographed by a camera based on commands from a control device,...

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Bibliographic Details
Main Authors KAMIHARASHI TAKASHI, NISHIMAKI KOJI
Format Patent
LanguageEnglish
Published 20.12.1999
Edition6
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:The present invention provides an apparatus and its method that is able to effectively use positional data such as coordinates and so forth stored in advance in a bonder. A first or second bonding point in the form of bonded sites is photographed by a camera based on commands from a control device, and inspection is performed as to whether a ball that has been bonded is present within a specified range at a location specified in advance and/or centering on said location.
Bibliography:Application Number: JP19930199235