JP2949044B

PURPOSE: To assure the reliability of a circuit for constituting an image pickup device and to reduce the size of the device by preventing the deterioration of the parts mounted on a circuit board by external environment, such as mechanical and electrical shock and air or thermal shock. CONSTITUTION...

Full description

Saved in:
Bibliographic Details
Main Author YOSHIMITSU KOICHI
Format Patent
LanguageEnglish
Published 13.09.1999
Edition6
Subjects
Online AccessGet full text

Cover

Loading…
More Information
Summary:PURPOSE: To assure the reliability of a circuit for constituting an image pickup device and to reduce the size of the device by preventing the deterioration of the parts mounted on a circuit board by external environment, such as mechanical and electrical shock and air or thermal shock. CONSTITUTION: Sealing is executed by a first sealant 11b having a low viscosity and, therefore, the sealant spreads sufficiently to the circumferences of bumps 11c inclusive of these bumps 11c even if the spacing between an IC 11 and the circuit board 10 is narrow. The durability to the shock and the external environment is thereby improved and since the entire part of the IC 11 and the first sealant 11b are sealed by a second sealant 11a having a high viscosity, the entire extension the sealants is kept small and, therefore, the miniaturization is made possible.
Bibliography:Application Number: JP19940282083