JP2936062B

A method for producing a semiconductor device includes: a) an attaching process in which a flat-plate member is positioned on a flat-shape lead frame provided with a plurality of leads and a plurality of support bars so that the flat-plate member contacts at least the plurality of leads, and the fla...

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Bibliographic Details
Main Authors KOBAYASHI HITOSHI, ASANO JUICHI, WAKAO KATSUNORI
Format Patent
LanguageEnglish
Published 23.08.1999
Edition6
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A method for producing a semiconductor device includes: a) an attaching process in which a flat-plate member is positioned on a flat-shape lead frame provided with a plurality of leads and a plurality of support bars so that the flat-plate member contacts at least the plurality of leads, and the flat-plate member is attached to plurality of support bars; b) an element mounting process in which a semiconductor element is mounted on the flat-plate member attached to the plurality of support bars of the flat-shape lead frame; c) a wire-bonding process in which a wire is provided between each of the plurality of leads and the semiconductor element; and d) a separating process, performed after the completion of the wire-bonding process, in which the plurality of support bars are deformed so as to separate the flat-plate member and the plurality of leads and electrically disconnect or separate the flat-plate member from the plurality of leads.
Bibliography:Application Number: JP19960298605