JP2911409B

PURPOSE: To provide a resin sealing type semiconductor device by a method wherein at least the longitudinal direction of an LSI chip is made small in size, a large chip is housed in a small package, the thermal stress of a wire bonding part and each structural part is reduced, lead buried length is...

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Bibliographic Details
Main Authors NAKAMURA SHOZO, NISHI KUNIHIKO, KANEDA AIZO, MITANI MASAO, MURAKAMI HAJIME
Format Patent
LanguageEnglish
Published 23.06.1999
Edition6
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PURPOSE: To provide a resin sealing type semiconductor device by a method wherein at least the longitudinal direction of an LSI chip is made small in size, a large chip is housed in a small package, the thermal stress of a wire bonding part and each structural part is reduced, lead buried length is secured, and the influence of the mechanical stress when a lead is formed is decreased. CONSTITUTION: This semiconductor device is provided with an LSI chip having a plurality of bonding pads 1 and a plurality of leads, having the prescribed inclined parts at least on inner leads 7, arranged in longitudinal direction of the above-mentioned LSI chip, the bonding pads 1 are arranged in a line in the center part of the LSI chip 5, and the tilt angle of the inclined part of the leads 7 becomes larger toward the end side of the LSI chip. Desirably, the width of the inner leads 7 is narrowed toward the bonding pads 1.
Bibliography:Application Number: JP19960191868