JP2884586B

PURPOSE:To form a polyamide compsn. for hollow molding with both surface properties and heat resistance while retaining good blow characteristics by compounding a polyamide of a specified MW range with a modified polyolefin and a mica. CONSTITUTION:The title compsn. contains 87-30wt.% polyamide resi...

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Bibliographic Details
Main Authors KITANI AKINOBU, FUJIMOTO TAKATOSHI, NAKANO KUNIO
Format Patent
LanguageEnglish
Published 19.04.1999
Edition6
Subjects
CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
THEIR PREPARATION OR CHEMICAL WORKING-UP
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Summary:PURPOSE:To form a polyamide compsn. for hollow molding with both surface properties and heat resistance while retaining good blow characteristics by compounding a polyamide of a specified MW range with a modified polyolefin and a mica. CONSTITUTION:The title compsn. contains 87-30wt.% polyamide resin (A) with a number-average MW of 20,000-50,000, 3-20wt.% modified polyolefin (B), and 10-50wt.% inorg. filler (C) consisting of a mica alone or a mica and another inorg. substance wherein the content of the mica is 5wt.% or higher. As the component A, polyamide 6, polyamide 66 and polyamide 6/66 copolymer are especially pref. The component B consists of 99.9-90mol% ethylene and/or propylene block- or graft-polymerized with 0.1-10mol% unsatd. carboxylic acid or deriv. thereof. As the inorg. substance beside the substance, wollastonite, tale, kaolin, fired clay, etc., can be cited.
Bibliography:Application Number: JP19890073773