JP2765236B

PURPOSE:To enable a heat dissipating fin which is lightweight and improved in heat conductivity to be formed by a method wherein a fin formed of aluminum alloy and a joint formed of specific composite material provided, and the fin and the joint are friction-welded together at their interface. CONST...

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Bibliographic Details
Main Authors ABE JUGAKU, OSADA MITSUO
Format Patent
LanguageEnglish
Published 11.06.1998
Edition6
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PURPOSE:To enable a heat dissipating fin which is lightweight and improved in heat conductivity to be formed by a method wherein a fin formed of aluminum alloy and a joint formed of specific composite material provided, and the fin and the joint are friction-welded together at their interface. CONSTITUTION:A heat dissipating fin 13 is provided with a fin 2 of aluminum alloy and a joint 9. The joint 9 is formed of composite material formed of Mo-Cu, Cu-W, or Al-Si. The fin 2 and the joint 9 are brought into close contact with each other through friction welding at an interface between them, and the fin 2 and the joint 9 are metallically bonded together at the interface. The joint 9 and the fin 2 are joined together through metallic bonding to form a heat dissipating fin 13, and the heat dissipating fin 13 is fixed to a semiconductor housing device 1 by bonding the joint 9 to a substrate 4 through a thermally conductive adhesive agent. The substrate 4 is formed of Mb-W composite material or Cu-W composite material, a package 5 is formed of alumina, and a lid 6 is formed of covar.
Bibliography:Application Number: JP19900409161