JP2758273B

PURPOSE:To contrive to improve heat-dissipation characteristics and earthing characteristics in a high-frequency planar circuit module. CONSTITUTION:In a structure for mounting on a body 9 of equipment a high-frequency planar circuit module formed by securing and arranging planar circuit parts 1, 2...

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Bibliographic Details
Main Author YABE NORIO
Format Patent
LanguageEnglish
Published 28.05.1998
Edition6
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PURPOSE:To contrive to improve heat-dissipation characteristics and earthing characteristics in a high-frequency planar circuit module. CONSTITUTION:In a structure for mounting on a body 9 of equipment a high-frequency planar circuit module formed by securing and arranging planar circuit parts 1, 2 with high-frequency planar circuits formed therein on a base substrate 3 and by arranging input/output terminal 5 in the edge part of said base substrate 3, a plurality of irregularities 11 are formed in a part on the side of the surface of said base substrate 3 brought into contact with said body 9 of equipment and a soft metal 12 is caused to intervene between the irregularities 11 of said base substrate 3 and said body of equipment 9 to press and fix said base substrate 3.
Bibliography:Application Number: JP19910015737