JP2732010B

Disclosed are a resorcinol resin adhesive composition which comprises a resorcinol resin modified by m-aminophenol, and a process for bonding wood materials by using the same.

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Bibliographic Details
Main Authors OGAWA MITSUTOSHI, SAIGAN JUKI
Format Patent
LanguageEnglish
Published 25.03.1998
Edition6
Subjects
ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE
ADHESIVES
CHEMISTRY
COMPOSITIONS BASED THEREON
DYES
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL
ORGANIC MACROMOLECULAR COMPOUNDS
PAINTS
POLISHES
THEIR PREPARATION OR CHEMICAL WORKING-UP
USE OF MATERIALS AS ADHESIVES
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Summary:Disclosed are a resorcinol resin adhesive composition which comprises a resorcinol resin modified by m-aminophenol, and a process for bonding wood materials by using the same.
Bibliography:Application Number: JP19930142518